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Accelerated sensor network design

   

Accelerated sensor network design

A new IO-Link master development kit from Renesas is designed to accelerate IO-Link-based application development for industrial networked devices in a smart factory.
The development kit includes a board and pre-qualified sample software provided by TMG. The board has eight IO-Link connectors allowing developers to immediately connect IO-Link slave devices and start the evaluation process.

The solution is supported by two CPUs that operate independently and simultaneously with a large built-in SRAM. The eight-port IO-Link Master is controlled by one CPU; the other CPU features an R-IN engine architecture and supports Industrial Ethernet communication to the upper layers, such as PLC, without any external microcontroller, microprocessor, or memory like DDR. Integrating the two CPUs in a small 12mm x 12mm LFBGA package also helps with designing compact PCBs.

For more than 25 years, Renesas has been providing a variety of solutions for the industrial automation market, supporting our customers as they catch the Industry 4.0 wave,” said Akira Denda, Vice President of Industrial Automation Business Unit, Renesas Electronics Corporation. “This new IO-Link Master solution, which is supported by TMG for its protocol stack, will help developers bring innovative applications to market easier and more quickly, and to expand the use of IO-Link-based applications in a smart factory.

www.renesas.com/us/en/products/software-tools/boards-and-kits/eval-demo/io-link-master-development-kit.html
 



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