Hirose: Connecting the future
Industrial Ethernet Book Issue 109 / 7
Request Further Info   Print this Page   Send to a Friend  

OPC UA extended including TSN down to the field level

THE OPC FOUNDATION IS PLEASED to announce the launch of its new setup to identify OPC UA and related TSN-harmonization needs and extends OPC Foundation standards and specifications.

The goal of this initiative is to deliver an open, cohesive approach to implement OPC UA including TSN and associated application profiles. This will advance the OPC Foundation providing vendor independent end-to-end interoperability into field level devices for all relevant industry automation use-cases. The OPC Foundation vision of becoming the worldwide industrial interoperability standard is advanced by integrating field devices and the shop floor.

A new set of working groups will identify, manage and standardize the OPC UA relevant topics focused on automation including:

  • Harmonization and standardization of application profiles e.g. IO, motion control, safety, system redundancy
  • Standardization of OPC UA information models for field level devices in offline e.g. device description and online e.g. diagnostics
  • Mapping of OPC UA application profiles related to real-time operations on Ethernet networks including TSN
  • Definition of certification procedures

The working groups will closely align with the TSN Profile for Industrial Automation (TSN-IA-Profile) which will be standardized by the IEC/IEEE 60802 standardization group. This will help ensure that a single, converged TSN network approach is maintained so that OPC UA can share one common multi-vendor TSN network infrastructure together with other applications.

This initiative integrates well with existing joint working groups engaged in ongoing companion specification e.g. description of machines.

Stefan Hoppe, President of the OPC Foundation said "The benefit of membership in the OPC Foundation allows companies to actively engage and influence the direction of the OPC Foundation and includes early access to the specifications and technology. This initiative will grow OPC UA into new markets and I highly encourage all OPC Foundation members to contact the OPC Foundation to participate".

Thomas Burke, Strategic Marketing Officer of the OPC Foundation, "We are very excited about the initiative to extend OPC UA including TSN down to the field level, and the number of companies that want to actively participate in this initiative bringing the technology into real world products. This set of working groups will pave the way for the broadest, easiest, and fastest market adoption of OPC UA over TSN."

News report by OPC Foundation.


Source: Industrial Ethernet Book Issue 109 / 7
Request Further Info    Print this Page    Send to a Friend  

Back

Sponsors:
Analog Devices: Time Sensitive Networking
DINSpace fiber optic and Cat 6 patch panels
ICP DAS at SecuTech Thailand
Japan IT Week Autumn

Get Social with us:



© 2010-2018 Published by IEB Media GbR · Last Update: 12.12.2018 · 36 User online · Privacy Policy · Contact Us