Congatec, a vendor of embedded and edge computing technology, has introduced a new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for high levels of shock and vibration resistance.

Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. For price sensitive applications, congatec also offers a cost optimized Intel Celeron based shock and vibration resistant variant for the extended temperature range from 0°C to 60°C.

Typical customers for the new range of Computer-on-Modules based on the Tiger Lake microarchitecture are OEMs of trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and many other mobile applications in the most challenging outdoor and off-road environments. All these applications can now benefit from super-fast LPDDR4X RAM with up to 4266 MT/s and in-band error-correcting code for single failure tolerance and high data transmission quality in EMI critical environments.

The value package includes rugged mounting options for the COM and carrier bundle, active and passive cooling options, optional conformal coating for protection against corrosion due to moisture or condensation, a list of recommended carrier board schematics, and for highest reliability, shock and vibration resistant components.

Congatec